Intel manufacturing business suffers setback as Broadcom tests disappoint, sources say
) contract manufacturing business has suffered a setback after tests with chipmaker Broadcom ( ) failed, three sources familiar with the matter told Reuters, dealing a blow to the company's turnaround efforts. The tests conducted by Broadcom involved sending silicon wafers - the foot-wide discs on which chips are printed - through Intel's most advanced manufacturing process known as 18A, the sources said. Broadcom received the wafers back from Intel last month. After its engineers and executives studied the results, the company concluded ...
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